Design and Manufacturing
- Chip & Wire Hybrids
- Multi Chip Modules
- Surface Mount Hybrids
- Chip On Board
- Power Hybrids
- Custom Packaging
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Sealing
- Seam Seal
- Cap Welding
- Ceramic Lid/Epoxy
- Glob Top
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Substrates
- Thick Film - Alumina, BeO, AlN
- Thin Film - Alumina, BeO
- Direct Bond Copper
- Polyimide, G10, Flex
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Electrical Testing
- DC & AC Testing
- Temperature Testing
- Data Recording
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Assembly
- Die Attachment; Epoxy, Solder, Eutectic
- Wirebonding; Gold & Aluminum, 1 to 20 mils
- Surface Mount
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Screening
- Acceleration
- Temperature Testing
- Hermetic; Fine and Gross
- Burn In
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