This hybrid contains 8 Analog integrated circuits and 83 capacitors.
The 1.2" x 3.25" substrate has 130 J leads attached.
Multi Chip Module
This hybrid contains 20 digital integrated circuits and 600 wire bonds. The thin film substrate is housed in a 1" x 1", 148 lead quad flat pack.
Optical Isolators
This hybrid contains 10 optical isolators, 10 integrated circuits, thick film resistors, and ceramic capacitors. The substrate is housed in a 44 pin bathtub package.